PCF2120U 查看數據表（PDF） - NXP Semiconductors.

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PCF2120U

Quartz oscillator

NXP Semiconductors. 

NXP Semiconductors

PCF2120

Quartz oscillator

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 8 and 9

Table 8. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

220

Table 9. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

350 to 2000

< 1.6

260

260

1.6 to 2.5

260

250

> 2.5

250

245

> 2000

260

245

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 11.

temperature

maximum peak temperature

= MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

peak

temperature

PCF2120_1

Product data sheet

MSL: Moisture Sensitivity Level

Fig 11. Temperature profiles for large and small components

Rev. 01 — 5 February 2008

time

001aac844

© NXP B.V. 2008. All rights reserved.

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