PCF2120U 查看數據表（PDF） - NXP Semiconductors.
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PCF2120U Datasheet PDF : 14 Pages
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NXP Semiconductors
15. Bare die outline
PCF2120
Quartz oscillator
Wire bond die; 7 bonding pads; 0.57 x 1.1 x 0.2 mm
PCF2120U
D
3
2
1
bonding pad 1
corner
A
x
0
E
0
y
45
6
7
X
DIMENSIONS (mm are the original dimensions)
UNIT A
D
E
P1
P2
P3
P4
P1 and P3: pad size
P2 and P4: passivation opening
mm
0.212
0.188
1.1
0.57 0.07 0.06 0.07 0.06
0
OUTLINE
VERSION
IEC
PCF2120U
REFERENCES
JEDEC
JEITA
P4 P3
P2
P1
detail X
0.5
scale
EUROPEAN
PROJECTION
1 mm
ISSUE DATE
07-12-07
08-02-01
Fig 10. Bare die outline PCF2120U
Table 7. Bonding pad coordinates
Values x and y in µm.
Pad
x
y
1
+313
+187
2
+93
+187
3
−236
+187
4
−259
−172
5
−137
−172
6
+127
−172
7
+380
−172
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
PCF2120_1
Product data sheet
Rev. 01 — 5 February 2008
© NXP B.V. 2008. All rights reserved.
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