PC8523-1 查看數據表（PDF） - NXP Semiconductors.
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PC8523-1 Datasheet PDF : 78 Pages
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NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
Version
PCF8523T
SO8
plastic small outline package; 8 leads;
body width 3.9 mm
SOT96-1
PCF8523TK
HVSON8
plastic thermal enhanced very thin small outline
package; no leads; 8 terminals;
body 4 4 0.85 mm
SOT909-1
PCF8523TS
TSSOP14 plastic thin shrink small outline package; 14 leads; SOT402-1
body width 4.4 mm
PCF8523U
bare die 12 bumps (6-6)
PCF8523U
4.1 Ordering options
Table 2. Ordering options
Product type
number
Sales item (12NC)
PCF8523T/1
935293581118
PCF8523TK/1
935293573118
PCF8523TS/1
935291196112
935291196118
PCF8523U/12AA/1 935293887005
Orderable part
number
PCF8523T/1,118
PCF8523TK/1,118
PCF8523TS/1,112
PCF8523TS/1,118
PCF8523U/12AA/1,00
IC
revision
1
1
1
1
1
Delivery form
tape and reel, 13 inch
tape and reel, 13 inch
tube
tape and reel, 13 inch
chips with bumps[1], sawn wafer on Film
Frame Carrier (FFC)
[1] Bump hardness see Table 53.
Table 3. PCF8523U wafer information
Type number
Wafer thickness
PCF8523U/12AA/1 200 m
5. Marking
Wafer diameter
6 inch
FFC for wafer size
8 inch
Marking of bad die
wafer mapping
Table 4. Marking codes
Type number
PCF8523T/1
PCF8523TK/1
PCF8523TS/1
PCF8523U/12AA/1
Marking code
8523T
8523
8523TS
PC8523-1
PCF8523
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 28 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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