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EK42451-01(2014) 查看數據表(PDF) - Peregrine Semiconductor Corp.

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EK42451-01 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Evaluation Kit
The SP5T switch EK Board was designed to ease
customer evaluation of Peregrine’s PE42451. The RF
common port is connected through a 50 transmission
line via the top SMA connector. RF1, RF2, RF3 and
RF4 are connected through 50 transmission lines via
side SMA connectors. A through 50 transmission is
available via SMA connectors RFCAL1 and RFCAL2.
This transmission line can be used to estimate the loss
of the PCB over the environmental conditions being
evaluated.
The EVK board is constructed with four metal layers on
dielectric materials of Rogers 4003C and 4450 with a
total thickness of 32 mils. Layer 1 and layer 3 provide
ground for the 50 ohm transmission lines. The 50 ohm
transmission lines are designed in layer 2 for high
isolation purpose and use a stripline waveguide design
with a trace width of 9.4 mils and trace metal thickness
of 1.8 mils. The board stack up for 50 ohm transmission
lines has 8 mil thickness of Rogers 4003C between
layer 1 and layer 2, and 10 mil thickness of Rogers
4450 between layer 2 and layer 3. Please consult
manufacturer's guidelines for proper board material
properties in your application. The PCB should be
designed in such a way that RF transmission lines and
sensitive DC i/o traces such as VssEXT are heavily
isolated from one another, otherwise the true
performance of the PE42451 will not be yielded.
PE42451
Product Specification
Figure 4. Evaluation Board Layouts
Peregrine Specification PRT-50444
Figure 5. Evaluation Board Schematic
Peregrine Specification DOC-44837
R1
0 OHM
R2
C1
DNI
1M
R3
0 OHM
C2
R4
100pF
1M
RFC
2
R5
0 OHM
C3
R6
100pF
1M
RF5
1
RF5
RF4
1
RF4
1 GND
2 RF5
3 GND
4 GND
5 RF4
6 GND
U1
PE4245x_24L_QFN
V2 18
V1 17
VDD 16
GND 15
RF1 14
GND 13
RF1
RF1
1
R7
0 OHM
C4
100pF
R9
0 OHM
C5
100pF
R8
1M
C6
1µF
RF3
1
RF3
RF2
RF2
1
RFCAL1
1 RF
RF CAL
STRIPLINE
©2009-2014 Peregrine Semiconductor Corp. All rights reserved.
Page 4 of 11
RFCAL2
1
VSS
VDD
V3
V2
V1
J1
HEADER 14
13 13
11 11
99
77
55
33
11
14 14
12 12
10 10
88
66
44
22
USE PCB 101-0479-03
Document No. DOC-22914-2 UltraCMOS® RFIC Solutions

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