PE42556DI-Z(2010) 查看數據表（PDF） - Peregrine Semiconductor Corp.
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PE42556DI-Z Datasheet PDF : 10 Pages
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PE42556
Product Specification
Table 6. Mechanical Specifications
Parameter
Die Size, Drawn (x,y)
Minimum
Typical
996 x 1896
Maximum
Die Size, Singulated (x,y)
1080 x 1980 1100 x 2000 1150 x 2050
Wafer Thickness
Wafer Size
Ball Pitch
Ball Height
Ball Diameter
UBM Diameter
180
200
220
150
400
72.25
85
97.75
110
85
90
95
Units
µm
µm
µm
mm
µm
µm
µm
µm
Test Conditions
As drawn
Including excess sapphire, max. tolerance
= -20/+50 µm
Typical
RoHS compliant lead-free solder balls
• Solder ball composition: 95.5%Sn/3.5%Ag/ 1.0%Cu
Table 7. Bump Coordinates
Bump # Bump Name
Bump Center (µm)
X
Y
1
VSS
400
850
2
DGND
400
450
3
GND4
400
50
4
RF2
400
-350
5
GND3
400
-750
6
RFC
0
-750
7
GND1
8
RF1
9
GND2
-400
-400
-400
-750
-350
50
10
LS
11
VDD
-400
450
-400
850
12
CTRL
0
850
13
DGND
0
450
14
DGND
0
50
All bump locations originate from the die center and refer to the
center of the bump.
Ball pitch is 400 µm.
Figure 18. Pad Layout (Bumps Up)
2000 µm
-20/+50 µm
Vdd
11
LS
10
GND
9
RF1
8
GND
7
CTRL
12
D-GND
13
Vss
1
D-GND
2
DGND
14
GND
3
RF2
4
RFC
GND
6
5
1100 µm
-20/+50 µm
Singulated Die size: 1.1 X 2.0 mm (400um ball pitch)
©2009-2010 Peregrine Semiconductor Corp. All rights reserved.
Page 8 of 10
Document No. 70-0289-05 │ UltraCMOS™ RFIC Solutions
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