PE42556DI(2010) 查看數據表（PDF） - Peregrine Semiconductor Corp.
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PE42556DI Datasheet PDF : 10 Pages
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PE42556
Product Specification
Figure 19. Tape and Reel Specifications
4.00 ± .05
(.157 ± .002)
.229 ± .02
(.009 ± .0008)
Bump 1
4.00 ± .05
(.157 ± .002)
1.50 + .10
(.059 + .004)
2.00 ± .05
(.079 ±.002)
1.75 ± .10
(.069 ± .004)
LOGO
Pin
#1
3.50 ± .05
(.138 ± .002)
Bo
8.00 +.30 -.10
(.315 +.012 - .004)
2.1± .05
(.083 ± .002)
Ao
1.2 ± .05
(.047 ± .002)
Tape Feed Direction
AO = 1.2
BO = 2.1
KO = 0.45
KO
.45 ± .05
(.018 ± .002)
Note: Bumped die are oriented active side down
Maximum cavity angle 5o
Bump 1
bump
side
down
Device Orientation in Tape
Drawing not drawn to scale, Pocket hole diameter 0.6±0.05mm
Table 8. Ordering Information
Order Code
PE42556DI
PE42556DI-Z
PE42556DBI
EK42556-01
Package
Die on cut Tape and Reel
Die on full Tape and Reel
Die in waffle pack
Evaluation Kit
Specification
81-0012
81-0012
81-0015
Shipping Method
Loose or cut tape
1,000 Dice / Reel
204 Dice / Waffle pack
1/ box
Document No. 70-0289-05 │ www.psemi.com
©2009-2010 Peregrine Semiconductor Corp. All rights reserved.
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