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PEC11S-929K-N0015 查看數據表(PDF) - Bourns, Inc

零件编号
产品描述 (功能)
生产厂家
PEC11S-929K-N0015
Bourns
Bourns, Inc Bourns
PEC11S-929K-N0015 Datasheet PDF : 3 Pages
1 2 3
Applications
Level control, tuning and timer settings in:
Audio-visual equipment
Consumer electric appliances
Radios
Musical instrumentation
Communications equipment
PEC11S Series - 12 mm SMD Incremental Encoder
Solder Profile
300
200
100
260 °C Max.
(3 Seconds Max.)
150 ± 5 °C
80~100 Seconds
Time
60 Seconds Max.
Processing Method: Reflow soldering with infrared heat or forced air convection (only once).
Notes:
1. No clean solder paste is recommended.
2. Aqueous wash is not recommended.
3. Use of water soluble soldering flux shall
be avoided due to possible corrosion.
4. Multiple passes through the soldering
process is not recommended.
Product Dimensions
Common Dimensions
(TOP VIEW)
8.1
(.319)
D
E
11.7
(.461)
3.0
(.118)
14.2
(.559)
3.0
(.118)
(TOP VIEW)
8.1
(.319)
D
E
11.7
(.461)
14.2
(.559)
5 PLCS.
1.0
(.039)
(BOTTOM VIEW)
5.0
(.197)
2.0 +0.03/-0.05
(.079 +.001/-.002)
DIA.
(SIDE VIEW)
4.5
(.177)
(SWITCH
OR
DUMMY
TERMINALS)
18.0
(.709)
18.0
(.709)
ACB
15.0
(.591)
ACB
15.0
(.591)
1.0
(.039)
TOLERANCES (UNLESS OTHERWISE NOTED): 10 = ±0.3
≤ (.394) ±(.012)
> 10 = ±0.5
>(.394) ±(.020)
1.5 +0.03/-0.05
(.059 +.001/-.002)
DIA.
5.0
(1.97)
(ENCODER)
1.2
(.047)
Recommended PCB Layout
7.5 ± 0.1
(.295 ± .004)
2.05 +0.1/-0
(.081 +.004/-0)
DIA.
HOLES
DIA.
HOLES
2.2 x 1.55 +0.1/-0
(.087 x .061 +.004/-0)
12.5 ± 0.1
(.492 ± .004)
6.3 ± 0.1
(.248 ± .004)
2.4 ± .01
(.094 ± .004)
8.2 ± 0.1
(.323 ± .004)
8.5 ± 0.1
(.335 ± .004)
4.5 ± 0.1
(.177 ± .004)
DIMENSIONS:
MM
(INCHES)
19.0 + 0.1
(.748 ± .004)
1.3 ± 0.1
(.051 ± .004)
5 PLCS.
12.6 + 0.1
5.0 ± 0.1
(.496 ± .004)
(.197 ± .004)
4.0 ± 0.1
2 PLCS. (.157 ± .004)
16.5 ± 0.1
9.0 ± 0.1
(.354 ± .004)
(.650 ± .004)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.

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