RC0805 查看數據表（PDF） - YAGEO Corporation
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RC0805 Datasheet PDF : 9 Pages
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Chip Resistor Surface Mount RC SERIES 0805 (RoHS Compliant)
Product specification 8
9
TEST
Intermittent
Overload
TEST METHOD
IEC 60115-1 4.39
PROCEDURE
2.5 times of rated voltage or maximum
overload voltage whichever is less for 1 second
on and 25 seconds off; total 10,000 cycles
REQUIREMENTS
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Solderability
- Wetting
IPC/JEDEC J-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching
IPC/JEDEC J-STD-002B test D Leadfree solder, 260 °C, 30 seconds
immersion time
- Resistance to IEC 60068-2-58
Soldering Heat
Condition B, no pre-heat of samples
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
±(0.5%+0.05 Ω) for 1% tol .
±(1.0%+0.05 Ω) for 5% tol.
<50 mΩ for Jumper
No visible damage
Jun 16, 2009 V.4
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