RD51EB2 查看數據表（PDF） - NEC => Renesas Technology
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RD51EB2 Datasheet PDF : 12 Pages
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Fig. 8 POWER DISSIPATION vs.
AMBIENT TEMPERATURE
600
RD2.0E to
RD120E
500
= 5 mm
= 10 mm
400
10 mm
300
200 P.C Board
φ 3 mm
100 t = 0.035 mm
P.C Board
7 mm
t = 0.035 mm
0 20 40 60 80 100 120 140 160 180 200
TA – Ambient Temperature – ˚C
Fig. 10 THERMAL RESISTANCE vs.
SIZE OF P.C BOARD
600
Junction to ambient
500
400
S
RD2.0E to
RD120E
300
= 10 mm
200
= 5 mm
100
0
20
40
60
80
100
S – Size of P.C Board – mm2
Fig. 12 DYNAMIC IMPEDANCE vs.
ZENER CURRENT
1 000
RD2.0E to
RD120E
TA = 25 ˚C
TYP.
100
RD51E
RD15E
RD100E
10
RD91E
1
0.01
0.1
RD3.3E
RDRD35.91EE
RD2.0E
RD3.9E
RD4.7E
RD20E
RD7.5E RD10E RD5.6E
1
10
100
IZ – Zener Current – mA
RD2.0E to RD200E
Fig. 9 POWER DISSIPATION vs.
AMBIENT TEMPERATURE
600
RD130E to
500
= 5 mm
RD200E
400
300
P.C Board
7 mm
t = 0.035 mm
200
100
0 20 40 60 80 100 120 140 160 180 200
TA – Ambient Temperature – ˚C
Fig. 11 THERMAL RESISTANCE vs.
SIZE OF P.C BOARD
600
Junction to ambient
500
400
S
= 5 mm
RD130E to
RD200E
300
200
100
0
20
40
60
80
100
S – Size of P.C Board – mm2
10 000
1 000
100
Fig. 13 DYNAMIC IMPEDANCE vs.
ZENER CURRENT
RD130E to RD200E
TA = 25 ˚C
TYP.
RD200E
RD190E
RD180E
RD170E
RD160E
RD130E
RD150E
RD140E
10
0.01
0.1
1
10
IZ – Zener Current – mA
7
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