RF3800 查看數據表（PDF） - RF Micro Devices

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RF3800

GaAs HBT PRE-DRIVER AMPLIFIER

RF Micro Devices 

RF3800

Thermal Pad and Via Design

The DUT must be connected to the PCB backside ground through a low inductance, low thermal resistance path. The required

interface is achieved with the via pattern shown below for both low inductance as well as low thermal resistance. The footprint

provided below worked well on the RFMD 20mil thick Rogers 4350 PCB and also standard FR4. The vias are 8mil vias that are

partially plated through and are finished to 8mils±2mils with a minimum plating of 1.5mil. Failure to place these vias within

the DUT mounting area on the PCB in this prescribed manner may result in electrical performance and/or reliability degrada-

3

tion.

Rev A9 DS070130

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

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