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RT8008-33PJ5 查看數據表(PDF) - Richtek Technology

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RT8008-33PJ5 Datasheet PDF : 14 Pages
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RT8008
Parameter
Symbol
Test Conditions
FB Input Current
PMOSFET RON
NMOSFET RON
P-Channel Current Limit
IFB
VFB = VIN
PRDS(ON) IOUT = 200mA
VIN = 3.6V
VIN = 2.5V
NRDS(ON) IOUT = 200mA
VIN = 3.6V
VIN = 2.5V
IP(LM)
VIN = 2.5V to 5.5 V
EN High-Level Input Voltage
VENH
VIN = 2.5V to 5.5V
EN Low-Level Input Voltage
VENL
VIN = 2.5V to 5.5V
Undervoltage Lock Out threshold
Min Typ Max Units
50 --
50 nA
-- 0.3 --
-- 0.4 --
-- 0.25 --
-- 0.35 --
1
-- 1.8 A
1.5 --
--
V
--
-- 0.4 V
-- 1.8 --
V
Hysteresis
-- 0.1 --
V
Oscillator Frequency
Thermal Shutdown Temperature
Min. On Time
fOSC
TSD
VIN = 3.6V, IOUT = 100mA
1.2 1.5 1.8 MHz
-- 160 --
°C
--
50
--
ns
Max. Duty Cycle
100 --
--
%
LX Leakage Current
VIN = 3.6V, VLX = 0V or VLX = 3.6V
1
--
1
µA
Note 1. Stresses listed as the above Absolute Maximum Ratingsmay cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard. Pin 2 of SOT-23-5/TSOT-23-5 packages is the case position for θJC
measurement.
DS8008-04 March 2007
www.richtek.com
5

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