RT9179A 查看數據表（PDF） - Richtek Technology

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RT9179A

Adjustable, 500mA LDO Regulator with Enable

Richtek Technology 

RT9179A

The RT9179ACS regulator is packaged in SOP-8 package.

This package is unable to efficiently dissipate the heat

generated when the regulator is operating at high power

levels. In order to control die-operating temperatures, the

PCB layout should allow for maximum possible copper

area at the GND pins of the RT9179ACS. The multiple

GND pins on the SOP-8 package are internally connected,

but lowest thermal resistance will result if these pins are

tightly connected on the PCB. This will also aid heat

dissipation at high power levels. If the large copper around

the IC is unavailable, a buried layer may be used as a heat

sink. Use vias to conduct the heat into the buried or

backside of PCB layer.

Use vias to conduct the heat into the

buried or backside of PCB layer.

RT9179ACS (SOP-8)

The PCB heat sink copper area should

be solder-painted without masked. This

approaches a “best case” pad heat sink.

To prevent this maximum junction temperature from being

exceeded, the appropriate power plane heat sink MUST

be used. Higher continuous currents or ambient

temperature require additional heatsinking.

www.richtek.com

10

DS9179A-07 March 2007

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