S29GL064M10TBIR62 查看數據表（PDF） - Spansion Inc.
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S29GL064M10TBIR62 Datasheet PDF : 116 Pages
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Data Sheet
63-Ball Fine-Pitch BGA
Top View, Balls Facing Down
A8
B8
NC*
NC*
L8
M8
NC*
NC*
A7
B7
C7
D7
E7
F7
G7
H7
J7
K7
L7
M7
NC*
NC*
A13
A12
A14
A15
A16 BYTE#1 DQ15/A-1 VSS
NC*
NC*
C6
D6
E6
F6
G6
H6
J6
K6
A9
A8
A10
A11
DQ7 DQ14 DQ13 DQ6
C5
D5
E5
F5
G5
H5
J5
K5
WE# RESET# A21
A19
DQ5 DQ12 VCC
DQ4
C4
D4
E4
F4
G4
H4
J4
K4
RY/BY# WP#/ACC A18
A20
DQ2 DQ10 DQ11 DQ3
C3
D3
E3
A7
A17
A6
F3
G3
H3
J3
K3
A5
DQ0 DQ8 DQ9 DQ1
A2
C2
D2
E2
F2
G2
H2
J2
K2
L2
M2
NC*
A3
A4
A2
A1
A0
CE# OE#
VSS
NC*
NC*
A1
B1
NC*
NC*
* Balls are shorted together via the substrate but not connected to the die.
L1
M1
NC*
NC*
Note: Ball H7 is VIO on S29GL064M (model R5).
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to tempera-
tures above 150°C for prolonged periods of time.
October 10, 2006 S29GL-M_00_B6
S29GL-M MirrorBitTM Flash Family
9
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