S29GL064M10FDIR52 查看數據表（PDF） - Spansion Inc.
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S29GL064M10FDIR52 Datasheet PDF : 116 Pages
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Data Sheet
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . 77
Figure 9. Maximum Negative Overshoot Waveform ................. 77
Figure 10. Maximum Positive Overshoot Waveform................. 77
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .78
CMOS Compatible ............................................................................................ 78
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
Figure 11. Test Setup ......................................................... 79
Table 37. Test Specifications ............................................... 79
Key to Switching Waveforms . . . . . . . . . . . . . . . .79
Figure 12. Input Waveforms and Measurement Levels............. 79
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .80
Read-Only Operations—S29GL256M Only ...............................................80
Read-Only Operations—S29GL128M only ................................................ 80
Read-Only Operations—S29GL064M Only ............................................... 81
Read-Only Operations—S29GL032M only ................................................ 82
Figure 13. Read Operation Timings ....................................... 82
Figure 14. Page Read Timings .............................................. 83
Hardware Reset (RESET#) ...............................................................................83
Figure 15. Reset Timings..................................................... 84
Erase and Program Operations—S29GL256M Only ............................... 85
Erase and Program Operations—S29GL128M Only ............................... 86
Erase and Program Operations—S29GL064M Only .............................. 87
Erase and Program Operations—S29GL032M Only .............................. 88
Figure 16. Program Operation Timings .................................. 89
Figure 17. Accelerated Program Timing Diagram .................... 89
Figure 18. Chip/Sector Erase Operation Timings ..................... 90
Figure 19. Data# Polling Timings
(During Embedded Algorithms) ............................................ 90
Figure 20. Toggle Bit Timings (During Embedded Algorithms) .. 91
Figure 21. DQ2 vs. DQ6 ...................................................... 91
Temporary Sector Unprotect ......................................................................... 91
Figure 22. Temporary Sector Group Unprotect Timing Diagram 92
Figure 23. Sector Group Protect and Unprotect Timing Diagram 92
Alternate CE# Controlled Erase and Program Operations—
S29GL256M .......................................................................................................... 93
Alternate CE# Controlled Erase and Program Operations—
S29GL128M ...........................................................................................................94
Alternate CE# Controlled Erase and Program Operations—
S29GL064M .......................................................................................................... 95
Alternate CE# Controlled Erase and Program Operations—
S29GL032M ..........................................................................................................96
Figure 24. Alternate CE# Controlled Write (Erase/
Program) Operation Timings ............................................... 97
Erase and Programming Performance . . . . . . . . . 98
TSOP Pin and BGA Package Capacitance . . . . . .98
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 99
TS040—40-Pin Standard Thin Small Outline Package (TSOP) ............99
TSR040—40-Pin Standard and Reverse Thin Small Outline Package
(TSOP) ................................................................................................................. 100
TS048—48-Pin Standard and Reverse Thin Small Outline Package
(TSOP) ...................................................................................................................101
TSR048—48-Pin Standard and Reverse Thin Small Outline Package
(TSOP) ..................................................................................................................102
TS056/TSR056—56-Pin Standard and Reverse Thin Small Outline Pack-
age (TSOP) ..........................................................................................................103
LAA064—64-Ball Fortified Ball Grid Array (FBGA) ..............................104
LAC064—64-Pin 18 x 12 mm Package .........................................................105
FBA048—48-Pin 6.15 x 8.15 mm Package ...................................................106
FBC048—48-Pin 8 x 9 mm Package ............................................................107
FBE063—63-Pin 12 x 11 mm Package ........................................................... 108
FPT-48P-M19 ...................................................................................................... 109
FPT-56P-M01 ....................................................................................................... 109
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 110
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S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B6 October 10, 2006
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