SA5225 查看數據表（PDF） - Philips Electronics
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SA5225 Datasheet PDF : 10 Pages
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Philips Semiconductors
Fiber optic postamplifier
Product specification
SA5225
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
CAZN
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
VSET
CAZP
2
1
16
15
VREF
GNDA
3
14
VCCE
DIN
DIN
4
5
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
13
12
DOUT
DOUT
VCCA
CF
6
7
8
11
9
10
GNDE
ST
ECN No.: 01671
1991 Jul 8
JAM
1998 Oct 07
Figure 8. SA5225 Bonding Diagram
7
ST
SD00493
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