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SC1454 查看數據表(PDF) - Semtech Corporation

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SC1454 Datasheet PDF : 14 Pages
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SC1454
POWER MANAGEMENT
Applications Information (Cont.)
R1 and R2 should be selected such that the current
flowing through them is 10µA (thus R2 120k).
Thermal Considerations
The worst-case power dissipation for this part is given
by:
( ) PD(MAX ) =
V V IN(MAX )
OUTA (MIN )
IOUTA (MAX )
( ) +
V V IN(MAX )
OUTB (MIN )
IOUTB (MAX )
(1)
+ VIN(MAX ) IQ(MAX )
For all practical purposes, equation (1) can be reduced
to the following expression:
( ) PD(MAX ) =
V V IN(MAX )
OUTA (MIN )
IOUTA (MAX )
( ) +
V V IN(MAX )
OUTB (MIN )
IOUTB (MAX )
(2)
impedance allowable to maintain TJ 125°C:
( ) θJA(MAX ) =
TJ(MAX ) TA(MAX )
PD(MAX )
=
(125 85)
0.334
= 120°C / W
This target value can be achieved by using one square
inch of board copper connected to the GND pin (pin 3),
which connects directly to the device substrate.
Increasing this area or the use of multi layer boards will
lower the junction temperature and improve overall
output voltage accuracy.
Layout Considerations
Looking at a typical application:
VIN(MAX) = 4.2V
VOUTA = 3V - 2% (worst case) = 2.94V
VOUTB = 3.3V - 2% (worst case) = 3.234V
IOUTA = IOUTB = 150mA
TA = 85°C
Inserting these values into equation (2) above gives us:
PD(MAX ) = (4.2 2.94)0.15 + (4.2 3.234)0.15
= 0.189 + 0.145
= 0.334W
Using this figure, we can calculate the maximum thermal
While layout for linear devices is generally not as critical
as for a switching application, careful attention to detail
will ensure reliable operation.
1) Attaching the part to a larger copper footprint will
enable better heat transfer from the device, especially
on PCBs where there are internal ground and power
planes.
2) Place the input, output and bypass capacitors close
to the device for optimal transient response and device
behaviour.
3) Connect all ground connections directly to the ground
plane. If there is no ground plane, connect to a common
local ground point before connecting to board ground.
2005 Semtech Corp.
7
www.semtech.com

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