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SC1566 查看數據表(PDF) - Semtech Corporation

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SC1566 Datasheet PDF : 12 Pages
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SC1566
POWER MANAGEMENT
Applications Information (Cont.)
Using this figure, and assuming TA(MAX) = 85°C, we can
calculate the maximum thermal impedance allowable to
maintain TJ 150°C (see page 7):
( ) ( ) R = TH(JA )(MAX )
TJ(MAX ) TA (MAX )
PD(MAX )
=
150 85
1.81
= 36°C / W
R TH(JC)(MAX ) = 3°C / W and R TH(CS) = 0°C / W,
therefore R TH(SA )(MAX ) = 33°C / W
This should be achievable for the TO-263 package using
pcb copper area to aid in conducting the heat away from
the device, such as a large (~2 squ. inch) pad connected
to the tab of the device. Internal ground/power planes
and air flow will also assist in removing heat. For higher
power dissipations it may be necessary to use a small
heatsink and the TO-220 package.
Co=2.2uF, Stable Region:
Unstable Region:
3mA
30mA
Load
300mA
0.001
0.01
0.1
1
ESR(Ohms)
3A
10
Co=22uF, Stable Region:
Unstable Region:
3mA
30mA
Load
300mA
0.001
0.01
0.1
1
ESR(Ohms)
3A
10
2005 Semtech Corp.
Co=220uF, Stable Region:
Unstable Region:
3mA
30mA
Load
300mA
0.001
0.01
0.1
1
ESR(Ohms)
3A
10
Figure 1. Phase-margin Contour Plot
8
www.semtech.com

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