SFH4205(2008) 查看數據表（PDF） - OSRAM GmbH
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SFH4205 Datasheet PDF : 9 Pages
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SFH 4200, SFH 4205
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020C)
(acc. to J-STD-020C)
300
˚C
T 250
200
255 ˚C
240 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
OHLA0687
260
˚C
+0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
235
˚C
+5 ˚C
-0 ˚C
10 s min
30 s max
150
Ramp Down
6 K/s (max)
120 s max
100 s max
100
Ramp Up
min. condition for IR Reflow Soldering:
50
3 K/s (max)
solder point temperature ≥ 235 °C for at least 10 sec.
25 ˚C
0
0
50
100
150
200
250
t
Wellenlöten (TTW)
TTW Soldering
(nach CECC 00802)
(acc. to CECC 00802)
s 300
300
C
T 250
200
150
100
50
10 s
235 C ... 260 C
1. Welle
1. wave
ca 200 K/s
100 C ... 130 C
2. Welle
2. wave
5 K/s
2 K/s
Zwangskühlung
2 K/s forced cooling
OHLY0598
Normalkurve
standard curve
Grenzkurven
limit curves
0
0
50
100
150
200
s
250
t
2008-01-14
8
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