SG1844 查看數據表（PDF） - Microsemi Corporation
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SG1844 Datasheet PDF : 12 Pages
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PRODUCT DATABOOK 1996/1997
SG1844/SG1845 Series
CURRENT-MODE PWM CONTROLLER
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Notes 1 & 2)
Supply Voltage (I < 30mA) ............................................................... Self Limiting
CC
Supply Voltage (Low Impedance Source) ........................................................ 30V
Output Current (Peak) ....................................................................................... ±1A
Output Current (Continuous) ....................................................................... 350mA
Output Energy (Capacitive Load) ....................................................................... 5µJ
Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V
Error Amp Output Sink Current ..................................................................... 10mA
Operating Junction Temperature
Hermetic (J, Y, F, L Packages) ................................................................... 150°C
Plastic (N, M, D, DM Packages) ................................................................ 150°C
Storage Temperature Range .......................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) .................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device.
Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified
terminal.
THERMAL DATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
N PACKAGE:
95°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DM PACKAGE:
65°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
D PACKAGE:
165°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Y PACKAGE:
120°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
J PACKAGE:
130°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
F PACKAGE:
80°C/W
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
L PACKAGE:
80°C/W
145°C/W
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
120°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θ numbers are guidelines for the thermal performance of the device/pc-board
JA
system. All of the above assume no ambient airflow.
PACKAGE PIN OUTS
COM
1
VFB
2
ISENSE
3
RT/CT 4
8
VREF
7
VCC
6 OUT UT
5 GND
M & Y PACKAGE
(Top View)
COM
VFB
ISENSE
RT/CT
1
8
VREF
2
7
VCC
3
6
OUT UT
4
5
GND
DM PACKAGE
(Top View)
COM
N.C.
VFB
N.C.
ISENSE
N.C.
RT/CT
1
14
VREF
2
13
N.C.
3
12
VCC
4
11
VC
5
10
OUT UT
6
9
GND
7
8
WR GND
D PACKAGE
(Top View)
COM
1
14
VREF
N.C. 2 13 N.C.
VFB
3
12
VCC
N.C. 4
11
VC
ISENSE
5
10
OUT UT
N.C. 6
9 GROUND
RT/CT
7
8
OWER GND
J & N PACKAGE
(Top View)
1. COM
2. VFB
3. ISENSE
4. RT/CT
5. OWER GND
1
10
2
9
3
8
4
7
5
6
10. VREF
9. VCC
8. VC
7. OUT UT
6. GND
F PACKAGE
(Top View)
3 2 1 20 19
1. N.C. 11. N.C.
2. N.C. 12. WR GND
4
18
3. COM . 13. GND
5
17
4. N.C.
14. N.C.
6
16
5. VFB
6. N.C.
15. OUT UT
16. N.C.
7
15
7. ISENSE
17. VC
8
14
8. RT/CT
18. VCC
9. N.C. 19. N.C.
9 10 11 12 13
10. N.C. 20. VREF
L PACKAGE
(Top View)
2
Copyright © 2000
Rev. 1.4 4/00
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