SMBJ18ACA 查看數據表（PDF） - STMicroelectronics

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产品描述 (功能)

生产厂家

SMBJ18ACA

Transil™

STMicroelectronics 

SMBJ

3

Package information

Package information

● Case: JEDEC DO-214AA molded plastic over planar junction

● Terminals: solder plated - solderable per MIL-STD-750, Method 2026

● Polarity: for unidirectional types the band indicates cathode

● Flammability: epoxy is rated UL94V-0

● RoHS package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Table 4. SMB dimensions

E1

Dimensions

Ref. Millimeters

Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

E

c 0.15 0.40 0.006 0.016

A1

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

C

A2

L

E1 4.05 4.60 0.159 0.181

b

L 0.75 1.50 0.030 0.059

Figure 13. Footprint dimensions

in mm (inches)

Figure 14. Marking layout(1)

1.62 2.60 1.62

(0.064) (0.102) (0.064)

2.18

(0.086)

5.84

(0.23)

Cathode bar ( unidirectional devices only )

e

xxx

z y ww

e: ECOPACK compliance

XXX: Marking

Z: Manufacturing location

Y: Year

WW: week

1. Marking layout can vary according to assembly location.

Doc ID 5616 Rev 10

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