MAS1017ATC1 查看數據表（PDF） - Micro Analog Systems Oy

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MAS1017ATC1

AM Receiver IC

Micro Analog Systems Oy 

3$' /$<287

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DA1017.001

5 January, 2001

966 5), 3'1 42 4,

0$6

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9'' '(& $*& 383 '&)

DIE size = 2.09 x 1.59 mm; PAD size = 100 x 100 µm

Substrate is connected to VDD. Please make sure that VDD is bonded first.

Note: Coordinates are calculated using VDD as a centre point.

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Power Supply Voltage

Demodulator Capacitor

AGC Capacitor

Power Up Input

DCF Signal Output

Quarz Filter Input

Quarz Filter Output

Power Down Input

Receiver Input

Power Supply Ground

1DPH

VDD

DEC

AGC

PUP

DCF

QI

QO

PDN

RFI

VSS

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0 µm

244 µm

520 µm

759 µm

1075 µm

1038 µm

760 µm

483 µm

243 µm

-15 µm

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0 µm

8 µm

8 µm

8 µm

8 µm

1625 µm

1625 µm

1625 µm

1625 µm

1605 µm

Notes:

1) Level = VSS means receiver on; VDD = receiver off (PUP = VSS)

Internal pull-up resistor > 1 MOhm to VDD

2) Level = VDD means receiver on; VSS = receiver off (PDN = VDD)

Internal pull-down resistor > 1MOhm to VSS

3) 100% AM results in Level = VSS; 25% AM results in Level = VDD

- the output is a current source/sink with |IOUT| > 5 µA

- at power down the output is tri-state

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2

3

1

2(6)

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