SP3011 查看數據表（PDF） - Littelfuse, Inc
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SP3011 Datasheet PDF : 4 Pages
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TVS Diode Arrays (SPA™Family of Products)
Low Capacitance ESD Protection - SP3011 Series
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
TP
TL
TS(max)
TS(min)
25
Ramp-up
Preheat
tS
time to peak temperature
tP
Critical Zone
TL to TP
tL
Ramp-down
Time
Part Numbering System
SP 3011 – 06 U T G
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Series
Number of
Channels
-06 = 6 Channels
G= Green
T= Tape & Reel
Package
uDFN-14 (3.5x1.35mm)
Part Marking System
RH6
Product Series
Number of
R = SP3011
Channels
Assembly Site
Product Characteristics
Lead Plating
Pre-Plated Frame
Lead Material
Lead Coplanarity
Subsitute Material
Body Material
Flammability
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL94-V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Ordering Information
Part Number
SP3011-06UTG
Package
uDFN-14
Marking
RH6
Min. Order Qty.
3000
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
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Revision: August 8, 2011
SP3011 Series
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