SP3012 查看數據表（PDF） - Littelfuse, Inc
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SP3012 Datasheet PDF : 6 Pages
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TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3012 Series
Package Dimensions — µDFN-14 (3.5x1.35x0.5mm)
PIN 1 Index Area
Seating A
Plane
C
Top View
D
A
1234
Side View
E
B
A1 A2
b
Bottom View
Pin 1 Identification
Chamfer 0.10X45º
Recomended
Soldering Pad Layout
µDFN-14 (3.5x1.35x0.5mm)
JEDEC MO-229
Symbol
Millimeters
Min
Nom
Max
Inches
Min
Nom
Max
A
0.45
0.50
0.55
0.018 0.020 0.022
A1
0.00
0.02
0.05
0.000 0.001 0.002
A2
0.203 Ref
0.008 Ref
b
0.15
0.20
0.25
0.006 0.008 0.012
D
3.40
3.50
3.60
0.134 0.138 0.142
D2
-
-
-
-
-
-
E
1.25
1.35
1.45
0.050 0.054 0.058
E1
-
-
-
-
-
-
e
0.500 BSC
0.020 BSC
L
0.25
0.30
0.35
0.010 0.012 0.014
Notes:
1. Dimension and tolerancing comform to ASME Y14.5M-1994.
2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily
exact.
Symbol
Millimeter
Symbol
D
E
b
L
e
s
s1
Soldering Pad Layout Dimensions
MIinlclihmes eters
Inches
Min
Nom
Max
Min
Nom
Max
3.29
3.30
3.31 0.1295 0.1299 0.1303
1.44
1.45
1.46 0.0567 0.0571 0.0575
0.29
0.30
0.31 0.0114 0.0118 0.0122
0.39
0.40
0.41 0.0154 0.0158 0.0161
0.50 typ
0.020 typ
0.19
0.20
0.21 0.0075 0.0078 0.0083
0.64
0.65
0.66 0.0252 0.0256 0.0260
Embossed Carrier Tape & Reel Specification — µDFN-14
P1
P2
P0 D0
E
User Feeding Direction
F
W
Pin 1 Location
D1
A0
T
K0
B0
Symbol
A0
B0
D0
D1
E
F
K0
P0
P1
P2
T
W
Millimeters
1.58 ± 0.10
3.73 ± 0.10
0.60 + 0.05
Ø 0.60 + 0.05
1.75 ± 0.10
5.50 ± 0.05
0.68 ± 0.10
2.00 ± 0.05
4.00 ± 0.10
4.00 ± 0.10
0.28 ± 0.02
12.00 + 0.30 /- 0.10
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
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