1N5818 查看數據表（PDF） - Motorola => Freescale
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1N5818 Datasheet PDF : 6 Pages
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1N5817 1N5818 1N5819
90
80
BOTH LEADS TO HEATSINK,
EQUAL LENGTH
70
60
MAXIMUM
50
TYPICAL
40
30
20
10
1 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0
L, LEAD LENGTH (INCHES)
Figure 4. Steady–State Thermal Resistance
5.0
Sine Wave
3.0 I(FM)= π (Resistive Load)
2.0 I(AV)
{5
Capacitive
1.0 Loads
10
0.7
20
0.5
0.3
0.2
dc
SQUARE WAVE
TJ ≈ 125°C
0.1
0.07
0.05
0.2
0.4 0.6 0.8 1.0
2.0
4.0
IF(AV), AVERAGE FORWARD CURRENT (AMP)
Figure 5. Forward Power Dissipation
1N5817–19
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.1 0.2
ZθJL(t) = ZθJL • r(t)
tp
Ppk
Ppk
DUTY CYCLE, D = tp/t1
PEAK POWER, Ppk, is peak of an
TIME equivalent square power pulse.
t1
∆TJL = Ppk • RθJL [D + (1 – D) • r(t1 + tp) + r(tp) – r(t1)]
where
∆TJL = the increase in junction temperature above the lead temperature
r(t) = normalized value of transient thermal resistance at time, t, from Figure 6, i.e.:
r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.
0.5 1.0 2.0 5.0
10 20
50 100 200
t, TIME (ms)
Figure 6. Thermal Response
500 1.0k 2.0k
5.0k 10k
NOTE 2 — MOUNTING DATA
Data shown for thermal resistance junction–to–ambient (RθJA) for
the mountings shown is to be used as typical guideline values for pre-
liminary engineering, or in case the tie point temperature cannot be
measured.
TYPICAL VALUES FOR RθJA IN STILL AIR
Mounting
Lead Length, L (in)
Method
1/8
1/4
1/2
3/4
1
52
65
72
85
2
67
80
87
100
3
50
RθJA
°C/W
°C/W
°C/W
Mounting Method 1
P.C. Board with
1–1/2″ x 1–1/2″
copper surface.
L
L
Mounting Method 2
L
L
VECTOR PIN MOUNTING
Mounting Method 3
P.C. Board with
1–1/2″ x 1–1/2″
copper surface.
L = 3/8″
BOARD GROUND
PLANE
Rectifier Device Data
3
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