SPVE 查看數據表（PDF） - Unspecified
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SPVE Datasheet PDF : 5 Pages
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Detector Switches
Soldering Conditions
Power
Push
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）at soldering portion（copper foil surface）. A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
Slide
Rotary
Encoders
Detector
Dual-in-line
Package Type
Multi Control
Devices
TACT
300
200
100
Room
temperature
Pre-heating
F max.
A max.
B
D
E
Time (s)
C
Custom-
Products
Series（Reflow type）
SPPB
A（℃）
3s max.
250
SPVE
260
B（℃）
230
C（s）
40
D（℃）
E（℃）
F（s）
SPPW8
250
200
20
SPVM
SPVR
SPVP
180
150
120
SPVN
SPVG
260
40
230
SPVL
SSCM
SPPY5
240
20
150
Room
Temperature
180
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. As the conditions vary some how depending on the kind of reflow soldering equipment, please make sure you have
the right one before use.
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