SST39SF010A 查看數據表（PDF） - Silicon Storage Technology
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SST39SF010A Datasheet PDF : 25 Pages
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1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39SF010A / SST39SF020A / SST39SF040
Data Sheet
TABLE 4: Software Command Sequence
Command
Sequence
1st Bus
Write Cycle
2nd Bus
Write Cycle
3rd Bus
Write Cycle
4th Bus
Write Cycle
5th Bus
Write Cycle
6th Bus
Write Cycle
Byte-Program
Sector-Erase
Chip-Erase
Software ID Entry4,5
Software ID Exit6
Software ID Exit6
Addr1
5555H
5555H
5555H
5555H
XXH
5555H
Data
AAH
AAH
AAH
AAH
F0H
AAH
Addr1
2AAAH
2AAAH
2AAAH
2AAAH
2AAAH
Data
55H
55H
55H
55H
55H
Addr1
5555H
5555H
5555H
5555H
5555H
Data
A0H
80H
80H
90H
F0H
Addr1
BA2
5555H
5555H
Data
Data
AAH
AAH
Addr1
2AAAH
2AAAH
Data
55H
55H
Addr1
SAX3
5555H
Data
30H
10H
1. Address format A14-A0 (Hex), Addresses AMS-A15 can be VIL or VIH, but no other value, for the Command sequence.
AMS = Most significant address
AMS = A16 for SST39SF010A, A17 for SST39SF020A, and A18 for SST39SF040
2. BA = Program Byte address
3. SAX for Sector-Erase; uses AMS-A12 address lines
4. The device does not remain in Software Product ID mode if powered down.
5. With AMS-A1 = 0; SST Manufacturer’s ID = BFH, is read with A0 = 0,
SST39SF010A Device ID = B5H, is read with A0 = 1
SST39SF020A Device ID = B6H, is read with A0 = 1
SST39SF040 Device ID = B7H, is read with A0 = 1
6. Both Software ID Exit operations are equivalent
T4.2 1147
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
Operating Range
Range
Commercial
Industrial
Ambient Temp
0°C to +70°C
-40°C to +85°C
VDD
4.5-5.5V
4.5-5.5V
AC Conditions of Test
Input Rise/Fall Time . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF for 55 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 100 pF for 70 ns
See Figures 14 and 15
©2010 Silicon Storage Technology, Inc.
7
S71147-09-000
01/10
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