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ST1284 查看數據表(PDF) - STMicroelectronics

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ST1284 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package information
4
Package information
ST1284
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 3. QSOP28 dimensions
b
D
28
1
L
A
e
a1
S
E
15
F
14
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
1.55
1.75 0.061 0.069
a1 0.10
b1
b
0.20
0.25 0.004 0.010
0.30 0.008 0.012
b1 0.18
0.25 0.007 0.010
D
9.80
9.98 0.386 0.393
E
3.80
3.98
0.15 0.157
e
0.64 typ.
0.025 typ.
F
5.79
6.20 0.228 0.244
L
0.40
0.90 0.016 0.035
S 8° max
8° max
Figure 10. Footprint (dimensions in mm)
0.64
0.40
1.50
3.70 6.70
Table 4.
Mechanical specifications
Lead plating
Lead plating thickness
Lead material
Lead coplanarity
Body material
Resin
Tin-lead
7 µm min.
25 µm max.
Copper Alloy
0.102 mm (0.004”)
Molded epoxy
Meets UL94V-0 standard
8/10
Doc ID 6976 Rev 4

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