STPS20H100CT/CF/CG/CG-1
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).
IFM(A)
100.0
10.0
1.0
Tj=150°C
Typical values
Tj=125°C
Typical values
Tj=125°C
Tj=25°C
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Fig. 10: Thermal resistance junction to ambient
versus coppersurface undertab(Epoxy printedcircuit
board FR4, copper thickness: 35µm) (D2PAK).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm )
0
0 5 10 15 20 25 30 35 40
PACKAGE MECHANICAL DATA
TO-220AB
H2
Dia
L2
F2
F1
F
G1
G
L5
L6
L9
L4
4/7
A
C
L7
D
M
E
REF.
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam.
DIMENSIONS
Millimeters
Inches
Min. Max. Min. Max.
4.40 4.60 0.173 0.181
1.23 1.32 0.048 0.051
2.40 2.72 0.094 0.107
0.49 0.70 0.019 0.027
0.61 0.88 0.024 0.034
1.14 1.70 0.044 0.066
1.14 1.70 0.044 0.066
4.95 5.15 0.194 0.202
2.40 2.70 0.094 0.106
10
10.40 0.393 0.409
16.4 typ.
0.645 typ.
13
14
0.511 0.551
2.65 2.95 0.104 0.116
15.25 15.75 0.600 0.620
6.20 6.60 0.244 0.259
3.50 3.93 0.137 0.154
2.6 typ.
0.102 typ.
3.75 3.85 0.147 0.151