TA7368FG 查看數據表（PDF） - Toshiba

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TA7368FG

Audio Power Amplifier

Toshiba 

TA7368PG/FG

PD – Ta

1.2

※ F + PCB

1.0

TA7368PG

θj − T = 210°C / W

0.8

※ F + PCB

0.6

0.4

TA7368FG

0.2

※ F+PCB

By being mounted on certain PCB's, flat packages increase

the heat dissipating efficiency.

Data shown on the left is resulted from the measurement

on the PCB recommended by TOSHIBA.

(θj−Τ : Thermal resistance)

0

0 20 40 60 80 100 120 140 160

Ambient Temperature Ta (°C)

Printed Circuit Board

Material: Phenol resin

Thickness of copper leaf: 35µm

Plate thickness: 1.6mm

8

2006-04-28

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