TDA2824 查看數據表（PDF） - STMicroelectronics

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TDA2824

DUAL POWER AMPLIFIER

STMicroelectronics 

TDA2824

MOUNTING INSTRUCTION

The Rth j-amb of the TDA2824 can be reduced by sol-

dering the GND pins to a suitable copperarea of the

printed circuit board (Figure 13) or to an external

heatsink (Figure 14).

The diagram of Figure 15 shows the maximum dis-

sipable power Ptot and the Rth j-amb as a function of

the side”∂” oftwo equalsquare copper areas having

a thickness of 35 µ (1.4 mils).

Figure 13 : Example of P.C. Board Copper Area

which is used as Heatsink.

During soldering the pins temperature must not ex-

ceed 260 °C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

Figure 14 : External Heatsink Mounting Example.

Figure 15 : Maximum Dissipable Power and

Junction to Ambient Thermal

Resistance vs. Side ”∂”.

Figure 16 : Maximum Allowable Power Dissipa-

tion vs. Ambient Temperature.

8/10

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