TGA4505 查看數據表（PDF） - TriQuint Semiconductor

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TGA4505

4 Watt Ka Band HPA

TriQuint Semiconductor 

TGA4505

Alternative Chip Assembly & Bonding Diagram

Single-Side Biasing Option

Vg1/Vg2/Vg3

Vd1/Vd2

Vd3

.01uf

.01uf

.01uf

100pf 100pf 100pf 100pf 100pf

RF IN

RF OUT

100pf

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

9

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