TLGE62T 查看數據表（PDF） - Toshiba
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TLGE62T Datasheet PDF : 12 Pages
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TL(RE,RME,SE,OE,YE,PYE,GE,FGE,PGE)62T(F)
Absolute Maximum Ratings (Ta = 25°C)
Product Name
TLRE62T(F)
TLRME62T(F)
TLSE62T(F)
TLOE62T(F)
TLYE62T(F)
TLPYE62T(F)
TLGE62T(F)
TLFGE62T(F)
TLPGE62T(F)
Forward Current
IF (mA)
50
50
50
50
50
50
50
50
50
Reverse Voltage
VR (V)
4
4
4
4
4
4
4
4
4
Power Dissipation
PD (mW)
120
120
120
120
120
120
120
120
120
Operating
Temperature
Topr (°C)
−40~100
Storage
Temperature
Tstg (°C)
−40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
Product Name
TLRE62T(F)
TLRME62T(F)
TLSE62T(F)
TLOE62T(F)
TLYE62T(F)
TLPYE62T(F)
TLGE62T(F)
TLFGE62T(F)
TLPGE62T(F)
Unit
Typ. Emission Wavelength
λd
λP
Δλ
IF
630 (644) 20
20
626 (636) 23
20
613 (623) 20
20
605 (612) 20
20
587 (590) 17
20
580 (583) 14
20
571 (574) 17
20
565 (568) 15
20
558 (562) 14
20
nm
mA
Luminous Intensity
IV
Min Typ.
IF
47.6 120
20
47.6 180
20
85
200
20
153 350
20
85
250
20
47.6 150
20
47.6 110
20
27.2 70
20
15.3 45
20
mcd
mA
Forward Voltage
VF
Typ. Max
IF
1.9
2.4
20
1.9
2.4
20
1.9
2.4
20
2.0
2.4
20
2.0
2.4
20
2.0
2.4
20
2.0
2.4
20
2.0
2.4
20
2.1
2.4
20
V
mA
Reverse Current
IR
Max
VR
50
4
50
4
50
4
50
4
50
4
50
4
50
4
50
4
50
4
μA
V
Precautions
Please be careful of the following:
• Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
2
2007-10-01
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