TMP47C243NG 查看數據表（PDF） - Toshiba
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TMP47C243NG Datasheet PDF : 64 Pages
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TMP47C243/443
1. Part number
2. Package code and dimensions
Previous Part Number Previous Package Code
(in Body Text)
(in Body Text)
New Part Number
New Package Code
OTP
TMP47C243N
TMP47C243M
TMP47C243DM
TMP47C443N
TMP47C443M
TMP47C443DM
P-SDIP28-400-1.78
P-SOP28-450-1.27
P-SSOP30-56-0.65
P-SDIP28-400-1.78
P-SOP28-450-1.27
P-SSOP30-56-0.65
TMP47C243NG
TMP47C243MG
TMP47C243DMG
TMP47C443NG
TMP47C443MG
TMP47C443DMG
SDIP28-P-400-1.78
SOP28-P-450-1.27B
SSOP30-P-56-0.65
SDIP28-P-400-1.78
SOP28-P-450-1.27B
SSOP30-P-56-0.65
TMP47P443VNG
TMP47P443VMG
TMP47P443VDMG
TMP47P443VNG
TMP47P443VMG
TMP47P443VDMG
*: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Lead solderability of Pb-free devices (with the G suffix)
Test
Solderability
Test Conditions
(1) Use of Lead (Pb)
·solder bath temperature = 230°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
(2) Use of Lead (Pb)-Free
·solder bath temperature = 245°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
Remark
Leads with over 95% solder coverage
till lead forming are acceptable.
II
2008-03-06
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