TPA270RL 查看數據表（PDF） - STMicroelectronics

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产品描述 (功能)

生产厂家

TPA270RL

Trisil™ for telecom equipment protection

STMicroelectronics 

Package information

SMP50 / SMTPA / TPA

Table 7. SMB dimensions

Dimensions

Ref.

Millimeters

Inches

E1

Min.

Max.

Min.

Max.

D

A1 1.90

2.45 0.075 0.096

A2 0.05

0.20 0.002 0.008

b

1.95

2.20 0.077 0.087

E

c

0.15

0.40 0.006 0.016

A1

E

5.10

5.60 0.201 0.220

C

A2

E1 4.05

4.60 0.159 0.181

L

b

D 3.30

3.95 0.130 0.156

L

0.75

1.50 0.030 0.059

Figure 13. Footprint, dimensions in mm (inches)

1.62 2.60

1.62

(0.064) (0.102) (0.064)

2.18

(0.086)

5.84

(0.300)

Table 8. DO-15 dimensions

Dimensions

C

A

C

Ref.

Millimeters

Inches

D

B

Min.

Max.

Min.

Max.

A

6.05

B

2.95

C

26

D 0.71

6.75 0.238 0.266

3.53 0.116 0.139

31

1.024 1.220

0.88 0.028 0.035

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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