Philips Semiconductors
Advanced pager receiver
Table 4 Bonding pad centre locations (dimensions in µm)
SYMBOL
TPI
TPQ
VI1RF
VI2RF
RRFA
GND1
VO2RF
VO1RF
VP
VI2MI
VI1MI
VI1MQ
VI2MQ
GND2
COM
RGYR
VO1MUL
VO2MUL
RMUL
SENSE
OSC
GND3
OSB
OSE
TS
BLI
DO
RE
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
DESCRIPTION
IF test point; I channel
IF test point; Q channel
pre-amplifier RF input 1
pre-amplifier RF input 2; note 1
external emitter resistor for pre-amplifier
ground 1 (0 V)
pre-amplifier RF output 2
pre-amplifier RF output 1
supply voltage
I channel mixer input 2
I channel mixer input 1
Q channel mixer input 1
Q channel mixer input 2
ground 2 (0 V)
gyrator filter resistor; common line
gyrator filter resistor
frequency multiplier output 1
frequency multiplier output 2
external emitter resistor for frequency multiplier
battery LOW detector sense input
oscillator collector
ground 3 (0 V)
oscillator base; crystal input
oscillator emitter
test switch; connection to ground for normal operation
battery LOW indicator output
data output
receiver enable input
lower left corner of chip (typical values)
Note
1. All x/y co-ordinates are referenced to the centre of pad 4 (VI2RF); see Fig.8.
Product specification
UAA2082
x
−32
−32
−32
0
472
1 160
1 688
2 232
2 760
3 608
4 216
4 216
4 216
4 216
4 216
4 216
4 216
4 176
3 668
2 952
2 312
1 832
1 328
432
−32
−32
−32
−32
−278
y
1 296
1 000
360
0
0
0
0
0
0
0
0
360
960
1 360
2 024
2 496
3 136
3 456
3 458
3 456
3 456
3 456
3 456
3 456
3 456
3 136
2 512
2 152
−186
1996 Jan 15
15