UPD75048CW 查看數據表（PDF） - NEC => Renesas Technology

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UPD75048CW

4-BIT SINGLE-CHIP MICROCOMPUTER

NEC => Renesas Technology 

µPD75048

14. RECOMMENDED SOLDERING CONDITIONS

It is recommended that µPD75048 be soldered under the following conditions. For details on the

recommended soldering conditions, refer to Information Document "Semiconductor Devices Mounting

Manual" (IEI-616). For other soldering methods and conditions, consult NEC.

Table 14-1 Soldering Conditions of Surface Mount Type

µPD75048GC - xxx - AB8: 64-pin plastic QFP ( 14 mm)

Soldering Method

Ware Soldering

Infrared Reflow

VPS

Pin Partial Heating

Soldering Conditions

Soldering bath temperature: 260°C max.,

time: 10 seconds max., number of times: 1,

maximum number of days: 2 days*,

(beyond this period, 16 hours of pre-baking is required

at 125°C), Pre-heating temperature: 120°C max.

Package peak temperature: 230°C,

time: 30 seconds max. (210°C min.),

number of times: 1, maximum number of days: 2 days*

(beyond this period, 16 hours of pre-baking is required

at 125°C)

Package peak temperature: 215°C,

time: 40 seconds max. (200°C min.),

number of times: 1, maximum number of days: 2 days*

(beyond this period, 16 hours of pre-baking is required

at 125°C)

Pin temperature: 300°C max.,

time: 3 seconds max. (per side)

Symbol for Recommended

Condition

WS60-162-1

IR30-162-1

VP15-162-1

—

*: Number of days after unpacking the dry pack. Storage conditions are 25°C and 65%RH max.

Note: Do not use two or more soldering methods in combination (except the pin partial heating

method).

Table 14-2 Soldering Conditions of Through-Hole Type

µPD75048CW - xxx: 64-pin plastic shrink DIP (750 mil)

Soldering Method

Wave soldering

(lead parts only)

Pin Partial Heating

Soldering Conditions

Soldering bath temperature: 260°C max.,

time: 10 seconds max.,

Pin temperature: 260oC max.,

time: 10 seconds max.

Caution: The wave soldering must be performed at the lead part only. Note that the

soldering must not be directly contacted to the board.

Notice

A model that can be soldered under the more stringent conditions (infrared reflow peak temperature:

235°C, numbver of times:2, and an extended number of days) is also available.

For details, consult NEC.

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