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UPS5817E3 查看數據表(PDF) - Microsemi Corporation

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UPS5817E3 Datasheet PDF : 4 Pages
1 2 3 4
SCOTTSDALE DIVISION
UPS5817e3 and UPS5819e3
POWERMITE 1™ SURFACE MOUNT
1 AMP 20 and 40 V SCHOTTKY RECTIFIERS
DESCRIPTION
The UPS5817e3 and UPS5819e3 offer a small and powerful surface mount
package that is RoHS compliant for a 1 Amp rated Schottky. These ratings
are found only in much larger packages. They are ideal for surface mount
applications that operate at high frequencies with their “hot carrier” features
that provide extremely fast switching. The very low thermal resistance of the
patented Powermite 1package design with a full metallic bottom and
unique locking tab act as an efficient heat path to a heat sink mounting permitting
cooler operating junction temperatures for minimal reverse leakage currents
and lower power loss. It is also ideal for automatic insertion equipment.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
DO-216
Powermite 1™
FEATURES
Low profile DO-216 package (<1.1 mm)
RoHS compliant with e3 suffix part number
Small footprint area of 8.45 mm2
Plastic package has Underwriters Laboratory
Flammability classification 94V-0
Unique locking tab on bottom acts as integral efficient
heat path to heat sink (mounting substrate)
Metal to silicon rectifier, majority carrier conduction
MAXIMUM RATINGS
Storage temperature (TSTG): -55 oC to +150oC
Operating junction temperature (TJ ): -55 oC to +150oC
Average forward rectified current (IO) @TC=100oC: 1.0
Amp
Forward surge current (IFSM) 8.3 ms single half-sine
waveform superimposed on rated load (JEDEC
Method): 50 Amps
Thermal resistance junction to case (bottom): 10 oC/W
Thermal resistance (RθJA): 240 oC/W on PCB with FR4
using 1 oz Copper and recommended mounting pad
size (see pad layout next page)
Solder temperatures: 260 ºC for 10 s (maximum)
APPLICATIONS / BENEFITS
High current capability with low forward voltage
Guard-ring-die construction for transient protection
Silicon Schottky (hot carrier) rectifier for minimal trr
and minimal reverse recovery voltage
Elimination of reverse-recovery oscillations to
reduce need for EMI filtering
For use in high-frequency switching power supplies,
inverters, free wheeling, charge pump circuits and
polarity protection applications
Lower forward power loss and high efficiency
Low inductive parasitics (<2nH) for minimal Ldi/dt
effects
Robust package configuration for pick-and-place
handling
Full-metallic bottom eliminates flux entrapment
Small foot print with 0.100 x 0.160 inches (see
mounting pad details on last page)
MECHANICAL AND PACKAGING
Terminals: Copper with annealed matte-Tin plating
for RoHS compliance solderable per MIL-STD-750
method 2026 (consult factory for Tin-Lead plating.)
Polarity: Backside is cathode
Marking: UPS5817e3 marked with S17•
and UPS5819e3 marked with S19•
Molded epoxy package meets UL94V-0
Weight: 0.016 grams (approximate)
Tape & Reel option: 12 mm tape per EIA-481-B
3000 units on 7 inch reel and 12,000 on 13” reel
(add TR7 or TR13 respectively to part number)
See package dimensions on last page
Copyright © 2007
10-15-2007 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

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