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VSC7122QM 查看數據表(PDF) - Vitesse Semiconductor

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VSC7122QM Datasheet PDF : 12 Pages
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VITESSE
SEMICONDUCTOR CORPORATION
Quad Port Bypass Circuit for 1.0625 Gbit/sec
Fibre Channel Arbitrated Loop Disk Arrays
Advance Product Information
VSC7122
Package Thermal Characteristics
The VSC7122 is packaged into a standard plastic quad flatpack with an embedded, but unexposed thermal
slug. This package adheres to industry standard EIAJ footprints for a 10x10mm body, 44 lead PQFP. The pack-
age construction is as shown in Figure 6. The 44 PQFP with embedded slug has the thermal properties shown in
Table 5. This package allows the VSC7122 to operate with ambient temperatures up to 70oC in still air.
Figure 6: Package Cross Reference
Wire Bond
Die
Plastic Molding Compound
Insulator
Lead
Table 5: 44 PQFP Thermal Resistance
Symbol
θca-0
θca-100
θca-200
θca-400
θca-600
Description
Thermal resistance from case to ambient, still air
Thermal resistance from case to ambient, 100 LFPM air
Thermal resistance from case to ambient, 200 LFPM air
Thermal resistance from case to ambient, 400 LFPM air
Thermal resistance from case to ambient, 600 LFPM air
Value
50
43
39
36
34
Units
oC/W
oC/W
oC/W
oC/W
oC/W
Moisture Sensitivity Level
This device is rated with a moisture sensitivity level 3 rating. Refer to Application Note AN-20 for appro-
priate handling procedures.
Page 10
© VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
G52155-0, Rev. 2.1
8/31/98

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