VSC7991CD 查看數據表（PDF） - Vitesse Semiconductor
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VSC7991CD Datasheet PDF : 10 Pages
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2354µm (0.0927")
IB
IB
Pad 34 Pad 35
GND
Pad 33
DOUT
Pad 32
GND
Pad 36
GND GND GND GND GND
Pad 37 Pad 38 Pad 39 Pad 40 Pad 41
VSS VSS VSS VSS
Pad 42 Pad 43 Pad 44 Pad 45
GND GND GND
Pad 46 Pad 47 Pad 48
GND
Pad 1
NDIN
Pad 2
GND
Pad 31
GND
Pad 30
1754µm
(0.0691")
GND
Pad 29
GND
Pad 28
VSC7991
GND
Pad 3
GND
Pad 4
GND
Pad 5
GND
Pad 6
GND
Pad 27
NDOUT
Pad 26
GND
Pad 25
IBN
IBN
IP
IP
GND GND
Pad 24 Pad 23 Pad 22 Pad 21 Pad 20 Pad 19
VIP
Pad 18
GND
Pad 7
VSS VSS VSS VSS
Pad 17 Pad 16 Pad 15 Pad 14
DCC
Pad 13
DIN
Pad 8
GND
Pad 9
GND GND
NC
Pad 12 Pad 11 Pad 10
50µm
(0.002")
NOTE: All dimensions are in micrometers. The 48 pads specified in the pad coordinates were merged into 24 larger pads.
Die Size: 2354µm x 1754µm (0.0927" x 0.0691")
Die Thickness: 381µm (0.015")
Pad Pitch: 150µm (0.0059")
Pad Size: 116µm x 116µm (0.0046" x 0.0046")
Pad Passivation Opening: 100µm x 100µm (0.0039" x 0.0039")
Scribe Size: 50µm (0.002")
50µm
(0.002")
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