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HMC292_08 查看數據表(PDF) - Hittite Microwave

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HMC292_08 Datasheet PDF : 6 Pages
1 2 3 4 5 6
v06.1007
Absolute Maximum Ratings
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85 °C)
(derate 4 mW/°C above 85 °C)
Thermal Resistance (R )
TH
(junction to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
+13 dBm
+27 dBm
150 °C
260 mW
250 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1C
Outline Drawing
HMC292
GaAs MMIC DOUBLE-BALANCED
MIXER, 18 - 32 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
4
Die Packaging Information [1]
Standard
Alternate
GP-5 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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