FSA2269 查看數據表（PDF） - ON Semiconductor

零件编号

产品描述 (功能)

生产厂家

FSA2269

Low-Voltage Dual-SPDT (0.4 Ω) Analog Switch with Negative Swing Audio Capability

ON Semiconductor 

July 2013

FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4 )

Analog Switch with Negative Swing Audio Capability

Features

 0.4 Ω Typical On Resistance (RON) for +3.0 V Supply

 0.25 Ω Ma ximum RON Flatness for +3.0 V Supply

 -3 db Bandwidth: > 50 MHz

 Low-ICCT Current Over an Expanded Control Input

Range

 Packaged in 10-Lead MicroPak™, UMLP, and

WLCSP

 Power-Off Protection on Common Ports

 Broad VCC Operating Range: 1.65 to 4.5 V

 Noise Immunity Termination Resistors in FSA2269TS

Applications

 Cell Phone, PDA, Digital Camera, and Notebook

 LCD Monitor, TV, and Set-Top Box

Description

The FSA2269 is a high-performance, dual Single-Pole

Double-Throw (SPDT) analog switch with negative swing

audio capability. The FSA2269 features ultra-low RON of

0.4  (typical) at 3.0 V VCC. The FSA2269 operates over

a wide VCC range of 1.65 V to 4.5 V, is fabricated with

sub-micron CMOS technology to achieve fast switching

speeds, and is designed for break-before-make

operation. The select input is TTL-level compatible.

The FSA2269 features very low quiescent current even

when the control voltage is lower than the VCC supply.

This feature suits mobile handset applications by

allowing direct interface with baseband processor

general-purpose I/Os with minimal battery consumption.

The FSA2269TS includes termination resistors that

improve noise immunity during overshoot excursions,

off-isolation coupling, or “pop-minimization.”

Ordering Information

Part Number

FSA2269L10X

FSA2269UMX

FSA2269TSL10X

FSA2269TSUMX

FSA2269UCX

Top Mark

Package Description

HL

10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm

HP

10-Lead, Quad Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8 mm,

0.4 mm Pitch

HU

10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm

HT

10-Lead, Quad Ultrathin Molded Leadless Package(UMLP), 1.4 x 1.8 mm,

0.4 mm Pitch

N9

12-Ball, Wafer-Level Chip Scale Package (WLCSP),1.2 x 1.6 mm, 0.4 mm Pitch

Analog Symbols

Figure 1. FSA2269

1B0

1A

1B1

3µs

S1

tON

10k

GND

2B0

2A

2B1

3µs

S2

tON

10k

GND

Figure 2. FSA2269TS (with Slow Turn On)

© 2007 Fairchild Semiconductor Corporation

FSA2269 / FSA2269TS • Rev. 1.1.5

www.f airchildsemi.com

Share Link: