STM6503SFABDG6F 查看數據表（PDF） - STMicroelectronics

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STM6503SFABDG6F

Dual push-button Smart Reset™ with user-adjustable setup delays

STMicroelectronics 

STM6502, STM6503, STM6504, STM6505

3

Maximum ratings

Maximum ratings

Stressing the device above the rating listed in Table 4: Absolute maximum ratings may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 4. Absolute maximum ratings

Symbol

Parameter

Value

Unit

TSTG

TSLD(1)

Storage temperature (VCC off)

Lead solder temperature for 10 seconds

–55 to +150

°C

260

°C

θJA

Thermal resistance (junction to ambient)

TDFN8

VIO

Input or output voltage

149.0

–0.3 to 5.5(2)

°C/W

V

VCC Supply voltage

–0.3 to 7

V

1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

2. For inputs or outputs with internal pull-up resistors and push-pull type outputs –0.3 to VCC+0.3 V only.

Doc ID 16101 Rev 6

15/29

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