HB01U 查看數據表（PDF） - C and D TECHNOLOGIES
零件编号
产品描述 (功能)
生产厂家
HB01U Datasheet PDF : 4 Pages
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MECHANICAL Package/Pinout "Y" and "Z"
DIP PACKAGE
1.285±0.010"
(32.64±0.25)
2423 22
1514 13
0.525±0.010"
(13.34±0.25)
HB01UxxyzzY
TOP VIEWS
1 23
10 11 12
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.100±0.010"
(2.54±0.25)
SIDE VIEWS
0.020±0.002"
(0.51±0.05)
SMD PACKAGE
1.285±0.010"
(32.64±0.25)
2423 22
1514 13
0.525±0.010"
(13.34±0.25)
HB01UxxyzzZ
0.695±0.015"
(17.65±0.38)
1 23
10 11 12
0.375±0.005"
(9.52±0.13)
0.015±0.005"
(0.38±0.13)
0.100±0.010"
(2.54±0.25)
0.020±0.002"
(0.51±0.05)
0°-15°
0.600"
(15.24)
0.125+0.030"
-0.000"
(3.18+0.76)
( -0.00)
END VIEWS
NU = Do Not Use.
NC = No Internal Connection.
Duplicate pin functions are internally connected.
All dimensions are in inches (millimeters).
GRID: 0.100 inches (2.54 millimeters)
Typically Marked with: specific model ordered, date code, job code and Logo.
MATERIAL: Units are encapsulated in a low thermal resistance molding
compound which has excellent chemical resistance, wide operating
temperature range, and good electrical properties under high humidity
environments. The encapsulant and outer shell of the unit have UL94V-0
ratings. Lead material is brass with a solder plated surface to allow ease of
solderability.
0.014±0.002"
(0.36±0.05)
.015±.010"
(.38±.25)
PIN CONNECTIONS
PIN# SINGLES DUALS
1
+VOUT
+VOUT
2
-VOUT
Common
3
NU
-VOUT
10
-VIN
-VIN
11
NC
NC
12
+VIN
+VIN
13
+VIN
+VIN
14
NC
NC
15
-VIN
-VIN
21
NC
NC
22
NU
-VOUT
23
-VOUT
Common
24
+VOUT
+VOUT
RECOMMENDED LAND PATTERN
0.100"
(2.54)
2423 22
1514 13
0.730"
(18.54)
0.040"
(1.02)
0.080"
(2.03)
1 23
1.150"
(29.21)
10 11 12
RECOMMENDED REFLOW PROFILE
30 sec MAX
(>220°C)
250
200
150
100
90 sec MAX
(>190°C)
50
235 °C MAX
220
190
TIME (seconds)
HB01U 11/98 REV B
Page 3
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