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SMC30J13CA(2020) 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
生产厂家
SMC30J13CA
(Rev.:2020)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
SMC30J13CA Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
SMC30JxxA, SMC30JxxCA
Reflow profile
2.2
Reflow profile
Figure 21. ST ECOPACK recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
0 30 60 90 120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
DS8598 - Rev 5
page 9/13

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