MAL215097602E3(2008) 查看數據表（PDF） - Vishay Semiconductors
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MAL215097602E3 Datasheet PDF : 9 Pages
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150 CRZ
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip), Very Low Z
e
d
b
b
f
d
Table 3
aca
a
c
a
Case size Ø D ≤ 10 mm
Case size Ø D ≥ 12.5 mm
Fig.3 Recommended soldering pad dimensions
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE CODE
a
b
c
d
e
f
0810
3.5
2.5
3.0
-
-
-
1010
4.3
2.5
4.0
-
-
-
1014
4.3
2.5
4.0
-
-
-
1213
5.5
2.5
4.0
4.2
5.0
5.6
1216
5.5
2.5
4.0
4.2
5.0
5.6
T (°C)
TPeak
230
217
200
150
t4
t3
t1
t2
time (s)
Fig.4 Maximum temperature load during reflow soldering
Table 4
REFLOW SOLDERING CONDITIONS
PROFILE FEATURES
CASE CODE
0810 to 1014
CASE CODE
1213 to 1216
Max. time from 25 °C to Tpeak
Max. ramp-up rate to 150 °C
240 s
3 K/s
200 s
3 K/s
Max. time from 150 °C to 200 °C, (t1)
Ramp up rate from 200 °C to Tpeak
Max. time from 200 °C - 217 °C, (t2)
Max. time above TLiquidus (217 °C) (t3)
Max. time above 230 °C (t4)
Peak temperature Tpeak
Max. time above Tpeak minus 5 °C
Max. ramp-down rate from TLiquidus
150 s
0.5 K/s to 3 K/s
60 s
90 s
40 s
250 °C
5s
6 K/s
120 s
0.5 K/s to 3 K/s
60 s
60 s
30 s
240 °C
10 s
6 K/s
Note
Temperature measuring point on top of the case and terminals max. 2 runs with pause of min. 30 minutes in between
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For technical questions, contact: aluminumcaps1@vishay.com
Document Number: 28395
Revision: 30-Oct-08
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