KA2903(2011) 查看數據表（PDF） - Fairchild Semiconductor
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KA2903 Datasheet PDF : 7 Pages
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Physical Dimensions
A
(.092) [Ø2.337]
PIN #1
[ ] .400 10.15
.373 9.46
.036 [0.9 TYP]
.250±.005 [6.35±0.13]
(.032) [R0.813]
PIN #1
TOP VIEW
OPTION 1
7° TYP
B
[ ] .070 1.78
.045 1.14
.310±.010 [7.87±0.25]
.130±.005 [3.3±0.13]
.210 MAX
[5.33]
7° TYP
TOP VIEW
OPTION 2
C
[ ] .021 0.53
.015 0.37
.001[.025] C
NOTES:
.015 MIN
[0.38]
[ ] .140 3.55
.125 3.17
.100
[2.54]
A. CONFORMS TO JEDEC REGISTRATION MS-001,
VARIATIONS BA
B. CONTROLING DIMENSIONS ARE IN INCHES
REFERENCE DIMENSIONS ARE IN MILLIMETERS
C. DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED
.010 INCHES OR 0.25MM.
D. DOES NOT INCLUDE DAMBAR PROTRUSIONS.
DAMBAR PROTRUSIONS SHALL NOT EXCEED
.010 INCHES OR 0.25MM.
E. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M-1994.
.300
[7.62]
.430 MAX
[10.92]
.060 MAX
[1.52]
[ ] .010+-..000005 0.254+-00..010207
N08EREVG
Figure 1. 8-Lead, DIP, JEDEC MS-001, .300" Wide
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without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2001 Fairchild Semiconductor Corporation
KA393 / KA2903 • Rev. 1.0.3
6
www.fairchildsemi.com
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