MKP1848510454K2(2009) 查看數據表（PDF） - Vishay Semiconductors

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MKP1848510454K2
(Rev.:2009)

Metallized Polypropylene Film Capacitors DC Capacitor MKP Type

Vishay Semiconductors 

MKP 1848 DC-Link

Vishay Roederstein Metallized Polypropylene Film Capacitors

DC Capacitor MKP Type

HEAT CONDUCTIVITY AND HOT SPOT TEMPERATURE

Wmax.

(mm)

9.0

11.0

13.0

15.0

18.0

18.5

21.0

21.5

24.0

25.0

30.0

35.0

45.0

87.0

PITCH 27.5 mm

31

37

42

48

58

-

68

-

-

-

-

-

-

-

HEAT CONDUCTIVITY (mW/°C)

PITCH 37.5 mm

-

-

-

-

-

89

-

102

116

-

134

-

-

-

PITCH 52.5 mm

-

-

-

-

-

-

-

-

-

152

181

197

213

341

POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE

The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of

the free air ambient temperature.

The component temperature rise (ΔT) can be measured or calculated by ΔT = P/G:

• ΔT = Component temperature rise (°C)

• P = Power dissipation of the component (mW)

• G = Heat conductivity of the component (mW/°C)

MEASURING THE COMPONENT TEMPERATURE

Thermocouple

The temperature is measured in unloaded (Tamb) and maximum loaded condition (TC).

The temperature rise is given by ΔT = Tc - Tamb.

To avoid thermal radiation or convection, the capacitor must be tested in a closed area from air circulation.

www.vishay.com

290

For technical questions, contact: dc-film@vishay.com

Document Number: 28164

Revision: 02-Feb-09

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