TDA2822(1995) 查看數據表（PDF） - STMicroelectronics
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TDA2822 Datasheet PDF : 11 Pages
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TDA2822
Figure 14 : Application Circuit for Portable Radios.
MOUNTING INSTRUCTION
The Rth j-amb of the TDA2822 can be reduced by sol-
dering the GND pins to a suitable copper area of the
printed circuit board (Figure 15) or to an external
heatsink (Figure 16).
The diagram of Figure 17 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
the side ”∂” oftwo equalsquare copperareas having
a thickness of 35 µ (1.4 mils).
Figure 15 : Example of P.C. Board Copper Area
which is used as Heatsink.
During soldering the pins temperature must not ex-
ceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 16 : External Heatsink Mounting Example.
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