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EHP-A07/UB01-P01 查看數據表(PDF) - Unspecified

零件编号
产品描述 (功能)
生产厂家
EHP-A07/UB01-P01
ETC
Unspecified ETC
EHP-A07/UB01-P01 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
EVERLIGHT ELECTRONICS CO.,LTD.
4. Soldering Condition
i. Lead reflow soldering temperature profile
EHP-A07/UB01-P01
ii. Reflow soldering should not be done more than two times.
iii. While soldering, do not put stress on the LEDs during heating.
iv. After soldering, do not warp the circuit board
5. Soldering Iron
i. For prototype builds or small series production runs it is possible to place and solder the LED by
hand.
ii. Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press
LED housing to closely connect LED and substrate.
iii. It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3
seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more
intervals, and do soldering of each terminal.
iv. Be careful because the damage of the product is often started at the time of the hand solder.
6. Handling Indications
During processing, mechanical stress on the surface should be minimized as much as possible. Sharp
objects of all types should not be used to pierce the sealing compound.
Everlight Electronics Co., Ltd.
Device No. : DSE-7N1-003
http://www.everlight.com
Prepared date: Sep 10, 2006
Rev. 2.0
Page: 10 of 11
Prepared by: Peggy Chen

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