CXA1846AM 查看數據表（PDF） - Sony Semiconductor

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产品描述 (功能)

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CXA1846AM

Electronic volume control

Sony Semiconductor 

Package Outline Unit : mm

CXA1846AM

20PIN SOP (PLASTIC)

+ 0.4

12.45 – 0.1

20

11

+ 0.4

1.85 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

10

1.27

+ 0.1

0.2 – 0.05

CXA1846AM/AN

CXA1846AN

0.24 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-20P-L01

SOP020-P-0300

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

0.3g

20PIN SSOP (PLASTIC)

∗6.5 ± 0.1

20

11

A

+ 0.2

1.25 – 0.1

0.1

1

10

0.65

b

0.13 M

0.1 ± 0.1

+ 0.1

b=0.22 – 0.05

(0.22)

b=0.22 ± 0.03

DETAIL B : SOLDER

DETAIL B : PALLADIUM

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-20P-L01

SSOP020-P-0044

NOTE: Dimension “∗” does not include mold protrusion.

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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